High-Strength Beryllium Copper Plates – C17200

Short Description:

Product Specifications
Name： Beryllium Copper Plate (BeCu Plate)
Standard： ASTM B194 / B196, UNS C17200 / C17500 / C17510, RoHS Compliant, REACH Compliant
Material： C17200 (High-Strength Beryllium Copper, 1.8-2.0% Be)
C17500 / C17510 (High-Conductivity Beryllium Copper, 0.4-0.7% Be)
Surface： Mill Finish, Optional Milled or Polished
Thickness： 0.5mm – 50mm
Width： 300mm – 1000mm
Length： 1000mm – 3000mm (custom sizes available)
Product Features:
Ultra-high strength (C17200) combined with excellent electrical conductivity (C17500/C17510) · Superior spring properties and fatigue resistance · Non-sparking and non-magnetic · Outstanding wear and corrosion resistance · Good machinability after heat treatment · Reliable performance in high-stress environments · Excellent thermal conductivity
Application Field:
Aerospace components and connectors, Electronic springs and relays, Injection mold tooling, Oil & gas drilling equipment, Non-sparking tools, Automotive sensors, Medical devices, Precision instruments, Defense and military hardware

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Beryllium Copper Plate – Process & Quality Assurance Statement
Our beryllium copper plates (C17200, C17500, C17510) are engineered for demanding applications that require the unique combination of high strength, conductivity, and reliability, where ordinary copper alloys would fall short.

Key process features

Production follows a tightly controlled metallurgical route to fully develop the alloy’s precipitation-hardening potential:
●Alloy Melting: High-purity copper is alloyed with precise beryllium additions under protective atmosphere to prevent oxidation.
●Casting & Hot Rolling: Ingots are cast and hot rolled into slabs with uniform composition and refined grain.
●Solution Annealing: Plates are heated to dissolve beryllium, followed by rapid quenching to create a supersaturated solid solution.
●Cold Working: Controlled reduction improves flatness and prepares for aging.
●Age Hardening: Low-temperature precipitation aging develops peak strength (C17200) or conductivity (C17500/C17510) while maintaining balance.
●Finishing: Plates are leveled, milled to exact thickness, and cut to size with clean edges.
●Protection & Packaging: Surfaces are cleaned and protected to prevent discoloration during storage and international shipping.

Quality control system

● Full traceability from raw alloy melt to finished plate
● Material test certificates and heat treatment reports supplied with every shipment
● Sample retention ≥3 years for third-party verification (SGS, BV, TÜV, etc.)
● 100% inspection of critical parameters:
• Chemical composition (optical emission spectrometry)
• Mechanical properties (tensile, yield, hardness, and conductivity on multiple samples)
• Dimensional accuracy (CMM and ultrasonic thickness; typical tolerance ±0.05mm)
• Surface quality and flatness (visual + profilometer checks)
• Internal soundness (ultrasonic scanning on thicker plates)
● Internal standards exceed ASTM B194 requirements. Typical properties:
C17200: Tensile strength ≥1200 MPa, Yield strength ≥1000 MPa
C17500/C17510: Electrical conductivity 45-60% IACS, Excellent fatigue and spring performance.
● ISO 9001:2015 certified facility ensures every beryllium copper plate delivers the superior strength, conductivity, and reliability your high-performance applications demand.